Communication substrate

Commonly used specifications: thickness 0.02-25mm, copper layer thickness ratio 10-40% Main applications: filter cover, etc. category: substrate Manager Zhang: 0543-7079617 Email:

Heat dissipation substrate

Commonly used thickness: 1-25mm, copper layer thickness ratio 10-15%. Radiator is the collective name for a series of devices used to conduct and release heat. Silver, copper, aluminum, diamond and graphene. Copper and aluminum are good conductors of heat, but graphene material technology needs to be improved. The cost of silver and diamond is too high, so copper and aluminum are generally the most commonly used heat dissipation materials. Copper has better thermal conductivity, and aluminum has better heat dissipation. The combination of copper and aluminum can achieve the effect of conducting heat and dissipating it faster. Through processing methods such as extrusion and shoveling, copper-aluminum composite materials can be processed into columnar and fin-shaped forms for use. category: substrate Manager Zhang: 0543-7079617 Email:

circuit board

Commonly used thickness: 0.03-0.3mm, copper layer thickness ratio 10-20% Main applications: new energy CCS, printed circuit boards, etc. category: substrate Manager Zhang: 0543-7079617 Email:

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